Ngspice BSIM (level 4) parameters
Name
|
Parameter
|
Units
|
l/w
|
---|---|---|---|
VFB
|
Flat-band voltage
|
V
|
*
|
PHI
|
Surface inversion potential
|
V
|
*
|
K1
|
Body effect coefficient
|
$\sqrt{V}$
|
*
|
K2
|
Drain/source depletion charge-sharing coefficient
|
-
|
*
|
ETA
|
Zero-bias drain-induced barrier-lowering coefficient
|
-
|
*
|
MUZ
|
Zero-bias mobility
|
$\frac{cm^{2}}{V \cdot sec}$
|
|
DL
|
Shortening of channel
|
μm
|
|
DW
|
Narrowing of channel
|
μm
|
|
U0
|
Zero-bias transverse-field mobility degradation coefficient
|
$\frac{1}{V}$
|
*
|
U1
|
Zero-bias velocity saturation coefficient
|
$\frac{\mu}{V}$
|
*
|
X2MZ
|
Sens. of mobility to substrate bias at v=0
|
$\frac{cm^{2}}{V^{2} \cdot sec}$
|
*
|
X2E
|
Sens. of drain-induced barrier lowering effect to substrate bias
|
$\frac{1}{V}$
|
*
|
X3E
|
Sens. of drain-induced barrier lowering effect to drain bias at Vds = Vdd
|
$\frac{1}{V}$
|
*
|
X2U0
|
Sens. of transverse field mobility degradation effect to substrate bias
|
$\frac{1}{V^{2}}$
|
*
|
X2U1
|
Sens. of velocity saturation effect to substrate bias
|
$\frac{\mu m}{V^{2}}$
|
*
|
MUS
|
Mobility at zero substrate bias and at Vds = Vdd
|
$\frac{cm^{2}}{V^{2}sec}$
|
|
X2MS
|
Sens. of mobility to substrate bias at Vds = Vdd
|
$\frac{cm^{2}}{V^{2}sec}$
|
*
|
X3MS
|
Sens. of mobility to drain bias at Vds = Vdd
|
$\frac{cm^{2}}{V^{2}sec}$
|
*
|
X3U1
|
Sens. of velocity saturation effect on drain bias at Vds=Vdd
|
$\frac{\mu m}{V^{2}}$
|
*
|
TOX
|
Gate oxide thickness
|
μm
|
|
TEMP
|
Temperature where parameters were measured
|
C
|
|
VDD
|
Measurement bias range
|
V
|
|
CGDO
|
Gate-drain overlap capacitance per meter channel width
|
$\frac{F}{m}$
|
|
CGSO
|
Gate-source overlap capacitance per meter channel width
|
$\frac{F}{m}$
|
|
CGBO
|
Gate-bulk overlap capacitance per meter channel length
|
$\frac{F}{m}$
|
|
XPART
|
Gate-oxide capacitance-charge model flag
|
-
|
|
N0
|
Zero-bias subthreshold slope coefficient
|
-
|
*
|
NB
|
Sens. of subthreshold slope to substrate bias
|
-
|
*
|
ND
|
Sens. of subthreshold slope to drain bias
|
-
|
*
|
RSH
|
Drain and source diffusion sheet resistance
|
$\frac{\Omega}{\square}$
|
|
JS
|
Source drain junction current density
|
$\frac{A}{m^{2}}$
|
|
PB
|
Built in potential of source drain junction
|
V
|
|
MJ
|
Grading coefficient of source drain junction
|
-
|
|
PBSW
|
Built in potential of source, drain junction sidewall
|
V
|
|
MJSW
|
Grading coefficient of source drain junction sidewall
|
-
|
|
CJ
|
Source drain junction capacitance per unit area
|
$\frac{F}{m^{2}}$
|
|
CJSW
|
source drain junction sidewall capacitance per unit length
|
$\frac{F}{m}$
|
|
WDF
|
Source drain junction default width
|
m
|
|
DELL
|
Source drain junction length reduction
|
m
|
xpart = 0 selects a 40/60 drain/source charge partition in saturation, while xpart=1 selects a 0/100 drain/source charge partition. nd, ng, and ns are the drain, gate, and source nodes, respectively. mname is the model name, area is the area factor, and off indicates an (optional) initial condition on the device for dc analysis. If the area factor is omitted, a value of 1.0 is assumed. The (optional) initial condition specification, using ic=vds,vgs is intended for use with the uic option on the .tran control line, when a transient analysis is desired starting from other than the quiescent operating point. See the .ic control line for a better way to set initial conditions.